Patent Assignment Details
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| Reel/Frame: | 016398/0685 | |
| Pages: | 2 |
| | Recorded: | 03/17/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11083205
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Filing Dt:
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03/17/2005
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Publication #:
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Pub Dt:
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09/22/2005
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Title:
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Hardenable pressure-sensitive adhesive sheet for semiconductor and process for producing semiconductor device
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Assignee
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| 23-23, HONCHO, ITABASHI-KU |
| TOKYO, JAPAN 173-0001 |
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Correspondence name and address
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KENT E. BALDAUF
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WEBB ZIESENHEIM LOGSDON ORKIN, HANSON PC
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700 KOPPERS BUILDING
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436 SEVENTH AVENUE
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PITTSBURGH, PA 15219-1818
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