Patent Assignment Details
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| Reel/Frame: | 016413/0061 | |
| Pages: | 4 |
| | Recorded: | 09/17/2004 | | |
| Attorney Dkt #: | 67309-014 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10508052
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Filing Dt:
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09/17/2004
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Publication #:
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Pub Dt:
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07/14/2005
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Title:
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Bonding wire and an integrated circuit device using the same
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Assignee
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| 1073, OAZA-EDA, SHIGARAKI-SHI |
| KOUKOA-GUN, SHIGA, JAPAN 529-1811 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005-3096
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