Patent Assignment Details
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| Reel/Frame: | 016430/0472 | |
| Pages: | 4 |
| | Recorded: | 08/22/2005 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA PREVIOUSLY RECORDED ON REEL 016181 FRAME 0905. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTIVE ASSIGNMENT TO RE-RECORD ASSIGNMENT PREVIOUSLY RECORDED UNDER REEL AND FRAME 016181/0905. |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/30/2007
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Application #:
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11121847
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Filing Dt:
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05/03/2005
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Publication #:
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Pub Dt:
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11/09/2006
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Title:
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SEMICONDUCTOR PACKAGE WITH SELECTIVE UNDERFILL AND FABRICATION METHOD THERFOR
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Assignee
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| 5 YISHUN ST. 23 |
| SINGAPORE 768442, SINGAPORE |
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Correspondence name and address
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MIKIO ISHIMARU
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THE LAW OFFICES OF MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA RD., STE. A1
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SUNNYVALE, CA 94087
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