Patent Assignment Details
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| Reel/Frame: | 016444/0847 | |
| Pages: | 2 |
| | Recorded: | 12/15/2004 | | |
| Attorney Dkt #: | 2922-482 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10518030
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Filing Dt:
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12/15/2004
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Publication #:
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Pub Dt:
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07/28/2005
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Title:
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Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process
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Assignee
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| 1-11-1, OSAKI, SHINAGAWA-KU |
| TOKYO, JAPAN 141-8584 |
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Correspondence name and address
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ROBERT B. MURRAY
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ROTHWELL, FIGG, ERNST & MANBECK
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1425 K ST., N.W., SUITE 800
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WASHINGTON, D.C. 20005
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