Patent Assignment Details
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| Reel/Frame: | 016523/0116 | |
| Pages: | 5 |
| | Recorded: | 09/12/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/12/2013
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Application #:
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11196936
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Filing Dt:
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08/04/2005
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Publication #:
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Pub Dt:
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02/16/2006
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Title:
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ADHESIVE MATERIAL AND ADHESIVE PREPARATION
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Assignee
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| 1-2, SHIMOHOZUMI 1-CHOME |
| IBARAKI-SHI, OSAKA, JAPAN 567-8680 |
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Correspondence name and address
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JOHN KILYK, JR.
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LEYDIG, VOIT & MAYER, LTD.
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TWO PRU PLAZA - STE 4900, 180 N. STETSON
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CHICAGO, IL 60601-6780
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