Patent Assignment Details
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| Reel/Frame: | 016543/0642 | |
| Pages: | 3 |
| | Recorded: | 05/09/2005 | | |
| Attorney Dkt #: | 263412us0 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11044225
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Filing Dt:
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01/28/2005
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Publication #:
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Pub Dt:
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08/25/2005
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Title:
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Thermosetting resin composition, adhesive film and multilayer printed wiring board using same
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Assignee
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| NO. 15-1, KYOBASHI 1-CHOME |
| CHUO-KU |
| TOKYO 104-8315, JAPAN |
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Correspondence name and address
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OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
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1940 DUKE STREET
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ALEXANDRIA, VA 22314
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04/28/2024 10:40 AM
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