Patent Assignment Details
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Reel/Frame: | 016563/0977 | |
| Pages: | 6 |
| | Recorded: | 05/13/2005 | | |
Attorney Dkt #: | X2007.0181 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10997182
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Filing Dt:
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11/24/2004
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Publication #:
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Pub Dt:
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09/21/2006
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Title:
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Solder and thermoelectric module using the same
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Assignees
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5-20, KAMISUGI 3-CHOME, AOBA-KU |
SENDAI-SH, MIYAGI-KEN, JAPAN |
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10-1, NAKAZAWA-CHO, HAMAMATSU-SHI |
SHIZUOKA-KEN, JAPAN |
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Correspondence name and address
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MICHAEL J. SCHEER
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DICKSTEIN SHAPIRO MORIN, ET AL.
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1177 AVENUE OF THE AMERICAS
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41ST FLOOR
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NEW YORK, NY 10036-2714
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