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Reel/Frame:016576/0330   Pages: 3
Recorded: 07/26/2005
Attorney Dkt #:4459-140
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S CITY ADDRESS PREVIOUSLY RECORDED AT REEL 015048 FRAME 0232.
Total properties: 1
1
Patent #:
Issue Dt:
12/19/2006
Application #:
10791896
Filing Dt:
03/04/2004
Publication #:
Pub Dt:
09/09/2004
Title:
SEMICONDUCTOR CHIP PACKAGE
Assignors
1
Exec Dt:
04/17/2003
2
Exec Dt:
04/17/2003
Assignee
1
26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN R.O.C.
Correspondence name and address
LOWE HAUPTMAN & BERNER, LLP
1700 DIAGONAL ROAD, SUITE 300
ALEXANDRIA, VA 22314

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