Patent Assignment Details
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Reel/Frame: | 016576/0330 | |
| Pages: | 3 |
| | Recorded: | 07/26/2005 | | |
Attorney Dkt #: | 4459-140 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S CITY ADDRESS PREVIOUSLY RECORDED AT REEL 015048 FRAME 0232. |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/19/2006
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Application #:
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10791896
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Filing Dt:
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03/04/2004
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Publication #:
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Pub Dt:
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09/09/2004
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Title:
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SEMICONDUCTOR CHIP PACKAGE
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Assignee
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26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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LOWE HAUPTMAN & BERNER, LLP
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1700 DIAGONAL ROAD, SUITE 300
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ALEXANDRIA, VA 22314
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