Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 016630/0226 | |
| Pages: | 6 |
| | Recorded: | 10/10/2005 | | |
| Attorney Dkt #: | 72145.013300 |
| Conveyance: | RELEASE OF SECURITY INTEREST |
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Total properties:
6
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Patent #:
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Issue Dt:
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08/27/2002
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Application #:
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08954426
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Filing Dt:
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10/20/1997
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Publication #:
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Pub Dt:
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08/09/2001
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Title:
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CHIP SCALE PACKAGE USING LARGE DUCTILE SOLDER BALLS
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Patent #:
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Issue Dt:
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09/11/2001
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Application #:
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09114204
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Filing Dt:
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07/13/1998
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Title:
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METHOD FOR FORMING CHIP SCALE PACKAGE
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Patent #:
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Issue Dt:
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06/06/2006
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Application #:
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09575298
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Filing Dt:
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05/19/2000
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Title:
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SOLDER BAR FOR HIGH POWER FLIP CHIPS
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Patent #:
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Issue Dt:
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06/17/2003
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Application #:
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09668450
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Filing Dt:
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09/22/2000
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Title:
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POLYMER COLLAR FOR SOLDER BUMPS
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Patent #:
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Issue Dt:
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09/03/2002
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Application #:
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09766798
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Filing Dt:
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01/22/2001
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Publication #:
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Pub Dt:
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07/25/2002
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Title:
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ELECTROLESS NI/PD/AU METALLIZATION STRUCTURE FOR COPPER INTERCONNECT SUBSTRATE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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06/15/2004
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Application #:
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09885846
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Filing Dt:
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06/20/2001
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Publication #:
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Pub Dt:
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10/18/2001
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Title:
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METHOD FOR FORMING CHIP SCALE PACKAGE
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Assignee
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| 3701 E. UNIVERSITY DRIVE |
| PHOENIX, ARIZONA 85034 |
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Correspondence name and address
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BRUCE T. NEEL
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GREENBERG TRAURIG, LLP
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2375 E. CAMELBACK ROAD, SUITE 700
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PHOENIX, AZ 85016
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