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Patent Assignment Details

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Reel/Frame:	016630/0909			Pages:	17
		Recorded:	10/13/2005
Attorney Dkt #:	153325.00012
Conveyance:	SECURITY INTEREST IN LICENSED PATENTS

Total properties: 13

Patent #:	5547740	Issue Dt:	08/20/1996	Application #:	08408792	Filing Dt:	03/23/1995
Title:	SOLDERABLE CONTACTS FOR FLIP CHIP INTEGRATED CIRCUIT DEVICES

Patent #:	5607099	Issue Dt:	03/04/1997	Application #:	08426861	Filing Dt:	04/24/1995
Title:	SOLDER BUMP TRANSFER DEVICE FOR FLIP CHIP INTEGRATED CIRCUIT DEVICES

Patent #:	5632667	Issue Dt:	05/27/1997	Application #:	08496333	Filing Dt:	06/29/1995
Title:	NO COAT BACKSIDE WAFER GRINDING PROCESS

Patent #:	5803340	Issue Dt:	09/08/1998	Application #:	08536592	Filing Dt:	09/29/1995
Title:	COMPOSITE SOLDER PASTE FOR FLIP CHIP BUMPING

Patent #:	5891756	Issue Dt:	04/06/1999	Application #:	08883694	Filing Dt:	06/27/1997
Title:	PROCESS FOR CONVERTING A WIRE BOND PAD TO A FLIP CHIP SOLDER BUMP PAD AND PAD FORMED THEREBY

Patent #:	6184581	Issue Dt:	02/06/2001	Application #:	08977525	Filing Dt:	11/24/1997
Title:	SOLDER BUMP INPUT/OUTPUT PAD FOR A SURFACE MOUNT CIRCUIT DEVICE

Patent #:	5938862	Issue Dt:	08/17/1999	Application #:	09070070	Filing Dt:	04/30/1998
Title:	FATIGUE-RESISTANT LEAD-FREE ALLOY

Patent #:	6251501	Issue Dt:	06/26/2001	Application #:	09280946	Filing Dt:	03/29/1999
Title:	SURFACE MOUNT CIRCUIT DEVICE AND SOLDER BUMPING METHOD THEREFOR

Patent #:	6281106	Issue Dt:	08/28/2001	Application #:	09449820	Filing Dt:	11/25/1999
Title:	METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT

Patent #:	6375062	Issue Dt:	04/23/2002	Application #:	09706543	Filing Dt:	11/06/2000
Title:	SURFACE BUMPING METHOD AND STRUCTURE FORMED THEREBY

Patent #:	6570260	Issue Dt:	05/27/2003	Application #:	10075979	Filing Dt:	02/15/2002
Title:	SOLDER PROCESS AND SOLDER ALLOY THEREFOR

Patent #:	6811892	Issue Dt:	11/02/2004	Application #:	10226370	Filing Dt:	08/22/2002
Publication #:	US20040035909	Pub Dt:	02/26/2004
Title:	LEAD-BASED SOLDER ALLOYS CONTAINING COPPER

Patent #:	6619536	Issue Dt:	09/16/2003	Application #:	10379753	Filing Dt:	03/05/2003
Publication #:	US20030155402	Pub Dt:	08/21/2003
Title:	SOLDER PROCESS AND SOLDER ALLOY THEREFOR

Assignor

Exec Dt:

10/12/2005

Assignee

100 WASHINGTON STREET, 15TH FLOOR

WELLS FARGO PLAZA, MACS S4101-158

PHOENIX, ARIZONA 85003

Correspondence name and address
	SEAN D. JOHNSON, ESQ.
	TWO NORTH CENTRAL AVENUE
	ONE RENAISSANCE SQUARE
	PHOENIX, AZ 85004

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