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Patent Assignment Details
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Reel/Frame:016639/0179   Pages: 2
Recorded: 08/16/2005
Attorney Dkt #:mr2849-158
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/25/2007
Application #:
11195655
Filing Dt:
08/03/2005
Publication #:
Pub Dt:
02/08/2007
Title:
CHIP PACKAGING STRUCTURE WITHOUT LEADFRAME
Assignor
1
Exec Dt:
03/31/2005
Assignee
1
NO. 17, WU-CHUAN 3 RD.
WU-KU HSIANG
TAIPEI COUNTY 248, TAIWAN R.O.C.
Correspondence name and address
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE-SUITE 101
ELLICOTT CITY, MD 21043

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