Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 016644/0887 | |
| Pages: | 5 |
| | Recorded: | 09/20/2005 | | |
Attorney Dkt #: | 067309-0014 |
Conveyance: | RECORD TO ADD ADD AN ASSIGNEE ON REEL 016413 FRAME 0061. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10508052
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Filing Dt:
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09/17/2004
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Publication #:
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Pub Dt:
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07/14/2005
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Title:
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Bonding wire and an integrated circuit device using the same
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Assignees
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1073, OAZA-EDA, SHIGARAKI-CHO |
KOUKOA-GUN, SHIGA, 529-1811, JAPAN |
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10-1, FUKUURA 2-CHOME, KANAZAWA-KU |
YOKOHAMA-SHI, KANAGAWA 236-0004, JAPAN |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005-3096
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