Patent Assignment Details
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| Reel/Frame: | 016670/0814 | |
| Pages: | 3 |
| | Recorded: | 06/09/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/06/2005
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Application #:
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10673968
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Filing Dt:
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09/29/2003
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Publication #:
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Pub Dt:
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04/22/2004
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Title:
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ELECTRONIC MODULE WITH A SEMICONDUCTOR CHIP WHICH HAS FLEXIBLE CHIP CONTACTS, AND METHOD FOR PRODUCING THE ELECTRONIC MODULE
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Assignee
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| ST.-MARTIN-STRASSE 53 |
| MUENCHEN, GERMANY 81669 |
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Correspondence name and address
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LERNER AND GREENBERG
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P.O. BOX 2480
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HOLLYWOOD, FL 33022
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