Patent Assignment Details
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| Reel/Frame: | 016671/0868 | |
| Pages: | 3 |
| | Recorded: | 10/23/2005 | | |
| Attorney Dkt #: | 27-100 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/2010
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Application #:
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11163561
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Filing Dt:
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10/23/2005
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Publication #:
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Pub Dt:
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05/18/2006
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME SUBSTRATE
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Assignee
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| NO. 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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THE LAW OFFICES OF MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA ROAD
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SUITE A1
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SUNNYVALE, CA 94087
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05/15/2024 03:41 AM
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