Patent Assignment Details
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| Reel/Frame: | 016689/0126 | |
| Pages: | 4 |
| | Recorded: | 10/26/2005 | | |
| Attorney Dkt #: | YAMAP0982US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/23/2008
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Application #:
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10535871
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Filing Dt:
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10/31/2005
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Publication #:
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Pub Dt:
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06/29/2006
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Title:
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SUBSTRATE-CUTTING SYSTEM, SUBSTRATE-PRODUCING APPARATUS, SUBSTRATE-SCRIBING METHOD, AND SUBSTRATE-CUTTING METHOD
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Assignee
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| 2-12-12, MINAMI-KANEDEN, SUITA-CITY |
| OSAKA, JAPAN 564-0044 |
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Correspondence name and address
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MARK D SARALINO
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RENNER, OTTO, BOISSELLE & SKLAR, LLP
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1621 EUCLID AVENUE, NINETEENTH FLOOR
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CLEVELAND, OH 44115
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