Patent Assignment Details
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| Reel/Frame: | 016703/0351 | |
| Pages: | 10 |
| | Recorded: | 06/15/2005 | | |
| Attorney Dkt #: | CS04-026 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/02/2011
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Application #:
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11153747
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Filing Dt:
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06/15/2005
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Publication #:
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Pub Dt:
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12/21/2006
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Title:
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GRAIN BOUNDARY BLOCKING FOR STRESS MIGRATION AND ELECTROMIGRATION IMPROVEMENT IN CU INTERCONNECTS
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Assignee
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| 60 WOODLANDS INDUSTRIAL PARK D |
| STREET TWO |
| SINGAPORE, SINGAPORE 738406 |
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Correspondence name and address
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WILLIAM STOFFEL
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PMB 455
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1735 MARKET ST. - STE. A
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PHILADELPHIA, PA 19103-7502
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