Patent Assignment Details
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| Reel/Frame: | 016722/0294 | |
| Pages: | 6 |
| | Recorded: | 11/03/2005 | | |
| Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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03/29/2005
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Application #:
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10360845
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Filing Dt:
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02/06/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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HIGH DENSITY CHIP LEVEL PACKAGE FOR THE PACKAGING OF INTEGRATED CIRCUITS AND METHOD TO MANUFACTURE SAME
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Patent #:
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Issue Dt:
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01/22/2008
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Application #:
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10715809
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Filing Dt:
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11/17/2003
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Publication #:
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Pub Dt:
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07/08/2004
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Title:
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HIGH SPEED LINEAR AND ROTARY SPLIT-AXIS WIRE BONDER
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Patent #:
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Issue Dt:
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10/11/2005
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Application #:
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11059825
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Filing Dt:
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02/16/2005
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Publication #:
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Pub Dt:
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07/07/2005
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Title:
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HIGH DENSITY CHIP LEVEL PACKAGE FOR THE PACKAGING OF INTEGRATED CIRCUITS AND METHOD TO MANUFACTURE SAME
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Patent #:
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Issue Dt:
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01/09/2007
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Application #:
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11121703
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Filing Dt:
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05/03/2005
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Publication #:
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Pub Dt:
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11/17/2005
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Title:
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METHOD OF BUMPING DIE PADS FOR WAFER TESTING
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Patent #:
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Issue Dt:
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01/22/2008
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Application #:
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11122939
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Filing Dt:
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05/05/2005
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Publication #:
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Pub Dt:
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11/17/2005
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Title:
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LOW-PROFILE CAPILLARY FOR WIRE BONDING
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Assignee
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| 2101 BLAIR MILL ROAD |
| WILLOW GROVE, PENNSYLVANIA 19090 |
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Correspondence name and address
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CHRISTOPHER M. SPLETZER, SR.
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2101 BLAIR MILL ROAD
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WILLOW GROVE, PA 19090
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