Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 016759/0319 | |
| Pages: | 4 |
| | Recorded: | 11/10/2005 | | |
| Attorney Dkt #: | 27-127 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/10/2012
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Application #:
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11164088
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Filing Dt:
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11/10/2005
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Publication #:
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Pub Dt:
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08/17/2006
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Title:
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METHOD OF MANUFACTURING NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING ETCHED DIFFERENTIAL HEIGHT LEAD STRUCTURES
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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THE LAW OFFICES OF MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA ROAD
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SUITE A1
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SUNNYVALE, CA 94087
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