Patent Assignment Details
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| Reel/Frame: | 016771/0449 | |
| Pages: | 3 |
| | Recorded: | 07/08/2005 | | |
| Attorney Dkt #: | SEC.1363 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/10/2006
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Application #:
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11176229
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Filing Dt:
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07/08/2005
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Publication #:
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Pub Dt:
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06/08/2006
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Title:
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GRINDING ASSEMBLY OF SEMICONDUCTOR WAFER BACK-GRINDING APPARATUS AND METHOD OF FASTENING A GRINDING PLATE TO A GRINDING MOUNT OF THE SAME
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Assignee
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| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI |
| GYEONGGIDO, KOREA, REPUBLIC OF |
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Correspondence name and address
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ADAM C. VOLENTINE
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VOLENTINE FRANCOS & WHITT, PLLC
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11951 FREEDOM DRIVE
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SUITE 1260
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RESTON, VA 20190
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