Patent Assignment Details
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| Reel/Frame: | 016772/0769 | |
| Pages: | 5 |
| | Recorded: | 07/14/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/30/2009
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Application #:
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11016924
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Filing Dt:
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12/21/2004
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Publication #:
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Pub Dt:
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11/03/2005
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Title:
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PLATING APPARATUS AND PLATING METHOD
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Assignees
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| 11-1, HANEDA ASAHI-CHO, OHTA-KU |
| TOKYO, JAPAN |
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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ATTN: MICHAEL I. HUPPERT, ESQ.
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2033 K STREET, N.W., SUITE 800
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WASHINGTON, DC 20006-1021
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