Patent Assignment Details
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| Reel/Frame: | 016790/0423 | |
| Pages: | 5 |
| | Recorded: | 09/13/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/18/2008
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Application #:
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11175761
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Filing Dt:
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07/06/2005
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Publication #:
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Pub Dt:
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01/12/2006
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Title:
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METHOD FOR WAFER BONDING (AL, IN, GA)N AND ZN(S, SE) FOR OPTOELECTRONIC APPLICATIONS
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Assignee
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| 1111 FRANKLIN STREET, 12TH FLOOR |
| OAKLAND, CALIFORNIA 94607 |
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Correspondence name and address
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GEORGE H. GATES
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GATES & COOPER LLP
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6701 CENTER DRIVE WEST, SUITE 1050
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LOS ANGELES, CALIFORNIA 90045
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