Patent Assignment Details
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Reel/Frame: | 016795/0900 | |
| Pages: | 3 |
| | Recorded: | 11/18/2005 | | |
Attorney Dkt #: | MEGP0006USA1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/17/2013
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Application #:
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10454972
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Filing Dt:
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06/04/2003
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Publication #:
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Pub Dt:
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11/06/2003
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Title:
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METHOD FOR FABRICATING CHIP PACKAGE WITH DIE AND SUBSTRATE
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Assignee
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21, R&D 1ST. RD., SCIENCE-BASED INDUSTRIAL PARK HSINCHU |
HSIN-CHU CITY, TAIWAN |
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Correspondence name and address
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NORTH AMERICA INTELLECTUAL PROPERTY CORP
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P.O. BOX 506
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MERRIFIELD, VA 22116
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