Patent Assignment Details
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Reel/Frame: | 016799/0850 | |
| Pages: | 5 |
| | Recorded: | 11/18/2005 | | |
Attorney Dkt #: | SAND-01070US0 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11171095
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Filing Dt:
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06/30/2005
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Publication #:
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Pub Dt:
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01/04/2007
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Title:
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Method of reducing warpage in an over-molded IC package
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Assignee
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140 CASPIAN COURT |
SUNNYVALE, CALIFORNIA 94089 |
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Correspondence name and address
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BRIAN I. MARCUS, ESQ.
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685 MARKET STREET, SUITE 540
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SAN FRANCISCO, CA 94105
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05/10/2024 02:39 PM
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