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Patent Assignment Details
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Reel/Frame:016807/0873   Pages: 3
Recorded: 02/25/2005
Attorney Dkt #:355901-0111
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/20/2009
Application #:
10525592
Filing Dt:
02/25/2005
Publication #:
Pub Dt:
11/17/2005
Title:
METHOD OF BONING A POLYMER SURFACE TO A CONDUCTING OR SEMICONDUCTING SURFACE AND APPLICATION OF THE SAME
Assignors
1
Exec Dt:
01/28/2005
2
Exec Dt:
01/28/2005
Assignees
1
31/33 RUE DE LA FEDERATION
75752 PARIS 15EME, FRANCE
2
2/15 RUE DU BUISSON AUX FRAISES
ZI DE LA BONDE
91300 MASSY, FRANCE
Correspondence name and address
FOLEY AND LARDNER LLP
SUITE 500
3000 K STREET NW
WASHINGTON, DC 20007

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