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Reel/Frame:016809/0567   Pages: 2
Recorded: 07/25/2005
Attorney Dkt #:282-05
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/10/2009
Application #:
11188322
Filing Dt:
07/25/2005
Publication #:
Pub Dt:
02/02/2006
Title:
SEMICONDUCTOR CHIP-EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING SAME
Assignors
1
Exec Dt:
06/29/2005
2
Exec Dt:
07/14/2005
Assignee
1
80, OSHIMADA-MACHI
NAGANO-SHI, NAGANO, JAPAN 381-2287
Correspondence name and address
JOHN F. MCNULTY
PAUL & PAUL
2900 TWO THOUSAND MARKET STREET
PHILADELPHIA, PA 19103

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