Patent Assignment Details
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| Reel/Frame: | 016816/0486 | |
| Pages: | 3 |
| | Recorded: | 07/27/2005 | | |
| Attorney Dkt #: | 021653-012100US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/30/2006
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Application #:
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11191463
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Filing Dt:
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07/27/2005
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Title:
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PLANAR BOND PAD DESIGN AND METHOD OF MAKING THE SAME
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Assignee
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| 18 ZHANG JIANG ROAD, PUDONG NEW AREA |
| SHANGHAI, PRC, CHINA 201203 |
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Correspondence name and address
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RICHARD T. OGAWA
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TOWNSEND AND TOWNSEND AND CREW LLP
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TWO EMBARCADERO CENTER
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EIGHTH FLOOR
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SAN FRANCISCO, CALIFORNIA 94111-3834
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