Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 016841/0523 | |
| Pages: | 2 |
| | Recorded: | 09/26/2005 | | |
| Attorney Dkt #: | 021653-012200us |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/09/2008
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Application #:
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11176871
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Filing Dt:
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07/06/2005
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Publication #:
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Pub Dt:
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10/19/2006
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Title:
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METHOD OF FORMING LOW STRESS MULTI-LAYER METALLURGICAL STRUCTURES AND HIGH RELIABLE LEAD FREE SOLDER TERMINATION ELECTRODES
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Assignee
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| 18 ZHANG JIANG RD. |
| PUDONG NEW AREA, SHANGHAI, CHINA 201203 |
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Correspondence name and address
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KENT J. TOBIN
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TOWNSEND AND TOWNSEND AND CREW LLP
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TWO EMBARCADERO CENTER
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8TH FLOOR
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SAN FRANCISCO, CA 94111-3834
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