Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 016847/0165 | |
| Pages: | 2 |
| | Recorded: | 09/29/2005 | | |
| Attorney Dkt #: | 3209-104 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/28/2009
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Application #:
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10532717
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Filing Dt:
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09/29/2005
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Publication #:
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Pub Dt:
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03/16/2006
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Title:
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COPPER FOIL PROVIDED WITH DIELECTRIC LAYER FOR FORMING CAPACITOR LAYER, COPPER CLAD LAMINATE FOR FORMATION OF CAPACITOR LAYER USING SUCH COPPER FOIL WITH DIELECTRIC LAYER, AND METHOD FOR MANUFACTURING PRODUCING SUCH COPPER FOIL WITH DIELECTRIC LAYER FOR FORMATION OF CAPACITOR LAYER
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Assignee
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| 11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO 141-8584, JAPAN |
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Correspondence name and address
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ROBERT B. MURRAY
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ROTHWELL, FIGG, ERNST & MANBECK
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SUITE 800
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1425 K ST., N.W.
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WASHINGTON, D.C. 20005
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