Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 016872/0689 | |
| Pages: | 2 |
| | Recorded: | 08/10/2005 | | |
| Attorney Dkt #: | 63349.00033 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11200009
|
Filing Dt:
|
08/10/2005
|
|
Publication #:
|
|
Pub Dt:
|
08/10/2006
| | | | |
|
Title:
|
Method for fabricating semiconductor packages with semiconductor chips
|
|
|
Assignee
|
|
|
|
|
| NO. 6, LI-HSIN ROAD |
| SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
|
|
Correspondence name and address
|
| |
SQUIRE SANDERS & DEMPSEY L.L.P.
|
| |
8000 TOWERS CRESCENT DRIVE, 14TH FLOOR
|
| |
TYSONS CORNER, VIRGINIA 22182-2700
|
Search Results as of:
05/21/2024 07:55 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
