Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 016894/0773 | |
| Pages: | 4 |
| | Recorded: | 12/14/2005 | | |
| Attorney Dkt #: | TSMC 2004-0270A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/08/2011
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Application #:
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11306015
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Filing Dt:
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12/14/2005
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Publication #:
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Pub Dt:
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09/07/2006
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Title:
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SOLDER BUMP AND RELATED INTERMEDIATE STRUCTURE HAVING PRIMARY AND SECONDARY PORTIONS AND METHOD OF MANUFACTURING SAME
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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Correspondence name and address
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BAKER & MCKENZIE
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ON BEHALF OF TSMC
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2300 TRAMMELL CROW CENTER
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2001 ROSS AVENUE, SUITE 2300
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DALLAS, TX 75201
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