Patent Assignment Details
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Reel/Frame: | 016920/0059 | |
| Pages: | 2 |
| | Recorded: | 02/28/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/22/2008
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Application #:
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10525996
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Filing Dt:
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02/28/2005
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Publication #:
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Pub Dt:
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03/02/2006
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Title:
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Semiconductor wafer protection structure and laminated protective sheet for use therein
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Assignee
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23-23, HONCHO, ITABASHI-KU |
TOKYO, JAPAN 173-0001 |
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Correspondence name and address
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KENT E. BALDAUF
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WEBB ZIESENHEIM LOGSDON
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ORKIN & HANSON, P.C.
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700 KOPPERS BUILDING, 436 SEVENTH AVE.
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PITTSBURGH, PA 15219-1818
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