Patent Assignment Details
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Reel/Frame: | 016929/0075 | |
| Pages: | 2 |
| | Recorded: | 07/15/2005 | | |
Attorney Dkt #: | 1204.43988X00 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10500119
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Filing Dt:
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06/17/2005
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Publication #:
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Pub Dt:
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07/27/2006
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Title:
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Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them
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Assignee
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1-1, NISHISHINJUKU 2-CHOME |
SHINJUKU-KU, TOKYO 163-0449, JAPAN |
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Correspondence name and address
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ANTONELLI, TERRY, STOUT ET AL.
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1300 NORTH 17TH STREET - SUITE 1800
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ARLINGTON, VA 22209
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