Patent Assignment Details
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| Reel/Frame: | 017002/0857 | |
| Pages: | 4 |
| | Recorded: | 09/14/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/15/2008
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Application #:
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11226025
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Filing Dt:
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09/14/2005
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Publication #:
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Pub Dt:
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03/15/2007
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Title:
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SEMICONDUCTOR STACKED DIE/WAFER CONFIGURATION AND PACKAGING AND METHOD THEREOF
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Assignee
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| 6501 WILLIAM CANNON DRIVE WEST |
| LAW DEPARTMENT |
| AUSTIN, TEXAS 78735 |
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Correspondence name and address
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FREESCALE SEMICONDUCTOR, INC.
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MAIL DROP PL02
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7700 WEST PARMER LANE
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AUSTIN, TEXAS 78729
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