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Reel/Frame:017020/0816   Pages: 5
Recorded: 01/17/2006
Attorney Dkt #:FIS920050299US1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/29/2008
Application #:
11306932
Filing Dt:
01/17/2006
Publication #:
Pub Dt:
07/19/2007
Title:
METHOD FOR DIRECT ELECTROPLATING OF COPPER ONTO A NON-COPPER PLATEABLE LAYER
Assignors
1
Exec Dt:
12/05/2005
2
Exec Dt:
12/07/2005
3
Exec Dt:
12/06/2005
4
Exec Dt:
12/06/2005
5
Exec Dt:
12/14/2005
6
Exec Dt:
12/06/2005
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
INTERNATIONAL BUSINESS MACHINES CORPORAT
DEPT. 18G
BLDG. 300-482
2070 ROUTE 52
HOPEWELL JUNCTION, NY 12533

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