Patent Assignment Details
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Reel/Frame: | 017036/0480 | |
| Pages: | 2 |
| | Recorded: | 09/23/2005 | | |
Attorney Dkt #: | tak-0418/t-960 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11233672
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Filing Dt:
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09/23/2005
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Publication #:
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Pub Dt:
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03/30/2006
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Title:
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Wafer for compound semiconductor devices
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Assignee
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3-6-3, KITANO, NIIZA-SHI |
SAITAMA, JAPAN |
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Correspondence name and address
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MICHAEL P. DUNNAM
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WOODCOCK WASHBURN LLP
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ONE LIBERTY PLACE-46TH FLOOR
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PHILADELPHIA, PA 19103-7301
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