Patent Assignment Details
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| Reel/Frame: | 017047/0360 | |
| Pages: | 2 |
| | Recorded: | 07/07/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10537840
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Filing Dt:
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06/07/2005
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Publication #:
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Pub Dt:
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11/02/2006
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Title:
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Perforated plate for wafer chuck
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Assignee
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| 70 PASIR RIS INDUSTRIAL DRIVE 1 |
| SINGAPORE 519527 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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MATTHEW L. CUTLER
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7700 BONHOMMEE, SUITE 400
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ST. LOUIS, MO 63105
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