Patent Assignment Details
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| Reel/Frame: | 017054/0927 | |
| Pages: | 2 |
| | Recorded: | 09/29/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11237690
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Filing Dt:
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09/29/2005
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Publication #:
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Pub Dt:
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04/06/2006
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Title:
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Method for dividing semiconductor wafer along streets
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Assignee
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| 13-11, OMORI-KITA 2-CHOME, OTA-KU |
| TOKYO, JAPAN 143-8580 |
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Correspondence name and address
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MICHAEL A. MAKUCH
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SMITH, GAMBRELL & RUSSELL, LLP
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1850 M STREET, NW, SUITE 800
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WASHINGTON, D.C. 20036
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