Patent Assignment Details
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Reel/Frame: | 017070/0130 | |
| Pages: | 2 |
| | Recorded: | 10/04/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/30/2009
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Application #:
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11242019
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Filing Dt:
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10/04/2005
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Publication #:
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Pub Dt:
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04/13/2006
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Title:
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SILICON WAFER LASER PROCESSING METHOD AND LASER BEAM PROCESSING MACHINE
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Assignee
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13-11, OMORI-KITA 2-CHOME |
OTA-KU |
TOKYO 143-8580, JAPAN |
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Correspondence name and address
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MICHAEL A. MAKUCH
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SMITH, GAMBRELL & RUSSELL, LLP
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1850 M STREET, MW-SUITE 800
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WASHINGTON, D.C. 20036
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