Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 017076/0536 | |
| Pages: | 6 |
| | Recorded: | 04/19/2005 | | |
| Attorney Dkt #: | 62153PCT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10528476
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Filing Dt:
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03/19/2005
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Publication #:
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Pub Dt:
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02/23/2006
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Title:
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Sealing material for semiconductor device and method for production thereof
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Assignees
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| 12-1, YURAKU-CHO 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8405 |
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| SHINJYUKU MITSUI BLD. 6TH, 1-1 |
| NISHISHINJYUKU 2-CHOME, SHINJYUKU-KU |
| TOKYO 163-0406, JAPAN |
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Correspondence name and address
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ROBERT J. JACOBSON
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650 BRIMHALL STREET SOUTH
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ST. PAUL, MN 55116-1511
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