Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 017078/0705 | |
| Pages: | 3 |
| | Recorded: | 04/19/2005 | | |
| Attorney Dkt #: | 0099/013001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/22/2007
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Application #:
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10532004
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Filing Dt:
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10/28/2005
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Publication #:
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Pub Dt:
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05/18/2006
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Title:
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LEAD-FREE SOLDER, AND A LEAD-FREE JOINT
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Assignees
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| 3672, OOAZA INA, INA-SHI |
| NAGANO 396-0021, JAPAN |
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| 75-1, AZA CHOUDA, NARUMICHO, MIDORI-KU |
| NAGOYA, AICHI 458-8508, JAPAN |
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| 1-2-23, MINAMISHINAGAWA, SHINAGAWA-KU |
| TOKYO 140-0004, JAPAN |
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Correspondence name and address
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RANDOLPH A. SMITH
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SMITH PATENT OFFICE
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1901 PENNSYLVANIA AVE., N.W.
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SUITE 200
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WASHINGTON, D.C. 20006-3433
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