Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 017134/0177 | |
| Pages: | 3 |
| | Recorded: | 10/24/2005 | | |
| Attorney Dkt #: | 033.0089USC1(AF01468) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11257825
|
Filing Dt:
|
10/24/2005
|
|
Publication #:
|
|
Pub Dt:
|
05/04/2006
| | | | |
|
Title:
|
Semiconductor bonding pad and method of fabricating the same
|
|
|
Assignee
|
|
|
|
|
| ONE AMD PLACE |
| P.O. BOX 3453 |
| SUNNYVALE, CALIFORNIA 94088-3453 |
|
|
Correspondence name and address
|
| |
VINCENT B. INGRASSIA
|
| |
INGRASSIA FISHER & LORENZ, P.C.
|
| |
7150 E. CAMELBACK RD., STE. 325
|
| |
SCOTTSDALE, AZ 85251
|
Search Results as of:
05/07/2024 12:26 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
