Patent Assignment Details
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Reel/Frame: | 017166/0167 | |
| Pages: | 6 |
| | Recorded: | 10/28/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/28/2018
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Application #:
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11262184
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Filing Dt:
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10/28/2005
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Publication #:
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Pub Dt:
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05/03/2007
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Title:
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SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVATION LAYER
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Assignee
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NO. 21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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CHARLES E. BAXLEY, ESQUIRE
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SUITE 309
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99 JOHN STREET
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NEW YORK, NEW YORK 10038
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