Patent Assignment Details
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| Reel/Frame: | 017183/0846 | |
| Pages: | 2 |
| | Recorded: | 01/12/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11318875
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Filing Dt:
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12/28/2005
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Publication #:
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Pub Dt:
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06/28/2007
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Title:
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Packaging method for an assembly of image-sensing chip and circuit board
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Assignee
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| 7F, NO. 758, SEC. 4, BADE RD., SONGSHAN DISTRICT |
| TAIPEI CITY 105, TAIWAN R.O.C. |
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Correspondence name and address
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MORTIN J. ROSENBERG, ESQ.
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ROSENBERG, KLEIN & LEE
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3456 ELLICOTT CENTER DR
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SUITE 101
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ELLICOTT CITY, MD 21043
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