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Total properties:
23
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Patent #:
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Issue Dt:
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05/06/1997
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Application #:
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08351516
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Filing Dt:
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12/07/1994
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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08/20/1996
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Application #:
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08408792
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Filing Dt:
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03/23/1995
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Title:
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SOLDERABLE CONTACTS FOR FLIP CHIP INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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05/27/1997
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Application #:
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08496333
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Filing Dt:
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06/29/1995
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Title:
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NO COAT BACKSIDE WAFER GRINDING PROCESS
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Patent #:
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Issue Dt:
|
09/08/1998
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Application #:
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08536592
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Filing Dt:
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09/29/1995
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Title:
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COMPOSITE SOLDER PASTE FOR FLIP CHIP BUMPING
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Patent #:
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Issue Dt:
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04/06/1999
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Application #:
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08883694
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Filing Dt:
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06/27/1997
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Title:
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PROCESS FOR CONVERTING A WIRE BOND PAD TO A FLIP CHIP SOLDER BUMP PAD AND PAD FORMED THEREBY
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Patent #:
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Issue Dt:
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08/27/2002
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Application #:
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08954426
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Filing Dt:
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10/20/1997
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Publication #:
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Pub Dt:
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08/09/2001
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Title:
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CHIP SCALE PACKAGE USING LARGE DUCTILE SOLDER BALLS
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Patent #:
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Issue Dt:
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02/06/2001
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Application #:
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08977525
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Filing Dt:
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11/24/1997
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Title:
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SOLDER BUMP INPUT/OUTPUT PAD FOR A SURFACE MOUNT CIRCUIT DEVICE
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Patent #:
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Issue Dt:
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08/17/1999
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Application #:
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09070070
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Filing Dt:
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04/30/1998
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Title:
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FATIGUE-RESISTANT LEAD-FREE ALLOY
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Patent #:
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Issue Dt:
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09/11/2001
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Application #:
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09114204
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Filing Dt:
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07/13/1998
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Title:
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METHOD FOR FORMING CHIP SCALE PACKAGE
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|
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Patent #:
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|
Issue Dt:
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06/26/2001
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Application #:
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09280946
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Filing Dt:
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03/29/1999
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Title:
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SURFACE MOUNT CIRCUIT DEVICE AND SOLDER BUMPING METHOD THEREFOR
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09449820
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Filing Dt:
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11/25/1999
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Title:
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METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT
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Patent #:
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Issue Dt:
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06/06/2006
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Application #:
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09575298
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Filing Dt:
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05/19/2000
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Title:
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SOLDER BAR FOR HIGH POWER FLIP CHIPS
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Patent #:
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Issue Dt:
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06/17/2003
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Application #:
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09668450
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Filing Dt:
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09/22/2000
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Title:
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POLYMER COLLAR FOR SOLDER BUMPS
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Patent #:
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Issue Dt:
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04/23/2002
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Application #:
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09706543
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Filing Dt:
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11/06/2000
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Title:
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SURFACE BUMPING METHOD AND STRUCTURE FORMED THEREBY
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|
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Patent #:
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Issue Dt:
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09/03/2002
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Application #:
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09766798
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Filing Dt:
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01/22/2001
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Publication #:
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Pub Dt:
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07/25/2002
| | | | |
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Title:
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ELECTROLESS NI/PD/AU METALLIZATION STRUCTURE FOR COPPER INTERCONNECT SUBSTRATE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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06/15/2004
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Application #:
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09885846
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Filing Dt:
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06/20/2001
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Publication #:
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Pub Dt:
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10/18/2001
| | | | |
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Title:
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METHOD FOR FORMING CHIP SCALE PACKAGE
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|
|
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Patent #:
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|
Issue Dt:
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05/27/2003
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Application #:
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10075979
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Filing Dt:
|
02/15/2002
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Title:
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SOLDER PROCESS AND SOLDER ALLOY THEREFOR
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|
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Patent #:
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|
Issue Dt:
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07/19/2005
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Application #:
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10081239
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Filing Dt:
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02/25/2002
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Publication #:
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Pub Dt:
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08/29/2002
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Title:
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WELDING MACHINE AND WELDING METHOD FOR ENERGY WELDING OF CYLINDER MEMBERS
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Patent #:
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Issue Dt:
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11/02/2004
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Application #:
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10226370
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Filing Dt:
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08/22/2002
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Publication #:
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Pub Dt:
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02/26/2004
| | | | |
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Title:
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LEAD-BASED SOLDER ALLOYS CONTAINING COPPER
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Patent #:
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Issue Dt:
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09/16/2003
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Application #:
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10379753
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Filing Dt:
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03/05/2003
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Publication #:
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Pub Dt:
|
08/21/2003
| | | | |
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Title:
|
SOLDER PROCESS AND SOLDER ALLOY THEREFOR
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|
|
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Patent #:
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|
Issue Dt:
|
10/24/2006
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Application #:
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10672165
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Filing Dt:
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09/26/2003
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Publication #:
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Pub Dt:
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03/31/2005
| | | | |
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Title:
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WAFER-LEVEL MOAT STRUCTURES
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|
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Patent #:
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Issue Dt:
|
10/10/2006
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Application #:
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10672201
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Filing Dt:
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09/26/2003
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Publication #:
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Pub Dt:
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03/31/2005
| | | | |
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Title:
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FORMING PARTIAL-DEPTH FEATURES IN POLYMER FILM
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|
|
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Patent #:
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Issue Dt:
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03/14/2006
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Application #:
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11145948
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Filing Dt:
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06/07/2005
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Publication #:
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Pub Dt:
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12/08/2005
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Title:
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BUILD-UP STRUCTURES WITH MULTI-ANGLE VIAS FOR CHIP TO CHIP INTERCONNECTS AND OPTICAL BUSSING
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