Patent Assignment Details
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Reel/Frame: | 017232/0076 | |
| Pages: | 2 |
| | Recorded: | 02/02/2006 | | |
Attorney Dkt #: | 060937-5003 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/09/2009
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Application #:
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11260391
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Filing Dt:
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10/28/2005
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Publication #:
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Pub Dt:
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06/01/2006
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Title:
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COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING
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Assignee
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2520 BARRINGTON COURT |
HAYWARD, CALIFORNIA 94545-1163 |
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Correspondence name and address
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MORGAN, LEWIS & BOCKIUS LLP
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1111 PENNSYLVANIA AVENUE, NW
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WASHINGTON, D.C. 20004
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