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Patent Assignment Details
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Reel/Frame:017232/0076   Pages: 2
Recorded: 02/02/2006
Attorney Dkt #:060937-5003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/09/2009
Application #:
11260391
Filing Dt:
10/28/2005
Publication #:
Pub Dt:
06/01/2006
Title:
COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING
Assignor
1
Exec Dt:
01/26/2006
Assignee
1
2520 BARRINGTON COURT
HAYWARD, CALIFORNIA 94545-1163
Correspondence name and address
MORGAN, LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE, NW
WASHINGTON, D.C. 20004

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