Patent Assignment Details
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Reel/Frame: | 017234/0376 | |
| Pages: | 2 |
| | Recorded: | 11/03/2005 | | |
Attorney Dkt #: | 64412(71987) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11267708
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Filing Dt:
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11/03/2005
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Publication #:
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Pub Dt:
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08/24/2006
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Title:
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Package structure with chip embedded in substrate
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Assignee
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NO. 8, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN ROC |
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Correspondence name and address
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PETER F. CORLESS
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EDWARDS ANGEL PALMER, ET AL.
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P.O. BOX 55874
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BOSTON, MA 02205
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