Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 017252/0058 | |
| Pages: | 6 |
| | Recorded: | 11/21/2005 | | |
| Attorney Dkt #: | 04173.0495 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11221763
|
Filing Dt:
|
09/09/2005
|
|
Publication #:
|
|
Pub Dt:
|
05/18/2006
| | | | |
|
Title:
|
Wafer support plate, holding method of thin wafer, and manufacturing method of semiconductor device
|
|
|
Assignee
|
|
|
|
|
| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8001 |
|
|
Correspondence name and address
|
| |
FINNEGAN, HENDERSON, FARABOW, ET AL.
|
| |
MR. ERNEST F. CHAPMAN
|
| |
901 NEW YORK AVENUE, NW
|
| |
WASHINGTON, D.C. 20001-4413
|
Search Results as of:
04/27/2024 12:54 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
