Patent Assignment Details
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| Reel/Frame: | 017304/0790 | |
| Pages: | 3 |
| | Recorded: | 03/15/2006 | | |
| Attorney Dkt #: | CP-0130-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11308271
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Filing Dt:
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03/15/2006
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Publication #:
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Pub Dt:
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09/20/2007
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Title:
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METHOD FOR MONITORING THE FILLING PERFORMANCE OF COPPER PLATING FORMULA FOR MICROVIA FILLING
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Assignee
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| NO. 5-1, CHI LIN N. RD. |
| CHUNG LI CITY, TAOYUAN HSIEN, TAIWAN |
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Correspondence name and address
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PAI PATENT & TRADEMARK LAW FIRM
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1001 FOURTH AVENUE, SUITE 3200
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SEATTLE, WA 98154
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