Patent Assignment Details
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| Reel/Frame: | 017357/0287 | |
| Pages: | 2 |
| | Recorded: | 03/23/2006 | | |
| Attorney Dkt #: | OKI-US053001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11276766
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Filing Dt:
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03/14/2006
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Publication #:
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Pub Dt:
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09/21/2006
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Title:
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METHOD FOR LAMINATING CHIPS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
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Assignee
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| 7-12, TORANOMON 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8460 |
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Correspondence name and address
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STEVEN ROBERTS
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1-4-19, MINAMI-MORIMACHI, KITA-KU
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SHINJYU GLOBAL IP, SOUTH FOREST BLDG.
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OSAKA, 530-0054 JAPAN
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