Patent Assignment Details
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| Reel/Frame: | 017360/0222 | |
| Pages: | 3 |
| | Recorded: | 12/14/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11302698
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Filing Dt:
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12/14/2005
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Publication #:
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Pub Dt:
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08/30/2007
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Title:
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Bond pad structures with reduced coupling noise
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Assignee
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| NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C., 300-77 |
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Correspondence name and address
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DANIEL R. MCCLURE
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THOMAS, KAYDEN, HORSTEMEYER ETAL.
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100 GALLERIA PARKWAY
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SUITE 1750
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ATLANTA, GEORGIA 30339
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